Method of changing a switching module using pressure-applying device

ABSTRACT

A switching module may include a plurality of cooling plates stacked along a vertical direction, a switch disposed between the cooling plates, a first supporting member disposed below the lowermost cooling plate, a second supporting member disposed above the uppermost cooling plate, first and second pressing support portions disposed between the lowermost cooling plate and the first supporting member, and a pressing member disposed between the uppermost cooling plate and the second supporting member.

CROSS-REFERENCE TO RELATED APPLICATIONS

Pursuant to 35 U.S.C. § 119(a), this application claims the benefit ofearlier filing date and right of priority to Korean Application No.10-2018-0037096, filed on Mar. 30, 2018, which is herein expresslyincorporated by reference in its entirety.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present disclosure relates to a pressing device of a switchingmodule and a method of changing a switch in the switching module usingthe same.

2. Description of the Conventional Art

Due to the development of industry and the increase of the population,power demand is soaring, but power production is limited.

Accordingly, a power system for supplying power generated at aproduction site to a demand site stably without loss has becomeincreasingly important.

There is a need for FACTS (Flexible AC Transmission System) facilitiesfor power flow, system voltage, and stability improvement. The FACTSfacilities include reactive power compensation apparatuses such as a SVC(Static Var Compensator) or a STATCOM (STATic synchronous COMpensator).These reactive power compensation apparatuses are connected in parallelto a power system to compensate for reactive power required in the powersystem.

The SVC may be configured by combining a Thyristor Controlled Reactor(TCR) that controls the phase of a reactor using a thyristor accordingto its application, a Thyristor Switched Capacitor (TSC) that switches acapacitor, a Fixed Capacitor Bank, and the like.

The SVC may include a thyristor valve connected to a transformer tocontrol the voltage of the power system and a gate unit that controlsthe gate of the thyristor valve.

When a plurality of thyristors are connected in series to each other inthe thyristor valve and conducted under the control of the gate unit, ahigh voltage or a high current flows through the thyristor. In addition,each thyristor is heavy and bulky, so it is not easy to handle.

Therefore, in order to construct a thyristor valve in an SVC as anassembly, many considerations such as the arrangement of the thyristor,the insulation of the thyristor, the heat dissipation of the thyristor,the weight of the thyristor, and the volume of the thyristor must betaken into account.

However, an optimal SVC-related switch assembly has not yet beendeveloped to satisfy all of these requirements.

Moreover, when a switch is damaged in the switch assembly, any method ofefficiently replacing the damaged switch has not be presented.

SUMMARY OF THE INVENTION

The present disclosure is provided to solve the foregoing and otherproblems.

Another object of the present disclosure is to provide a switch assemblyof a reactive power compensation apparatus of a new structure.

Still another object of the present disclosure is to provide a switchassembly of a reactive power compensation apparatus having an optimalarrangement structure satisfying various requirements.

Yet still another object of the present disclosure is to provide apressing device capable of easily separating between cooling platesadjacent to each other.

Still yet another object of the present disclosure is to provide amethod of replacing a switch in a switching module capable of easilyreplacing a damaged switch.

In order to achieve the foregoing and other objects, according to anaspect of the present disclosure, there is provide a method of replacinga switch in a switching module including a plurality of cooling platesstacked along a vertical direction; a switch disposed between thecooling plates; a first supporting member disposed above the uppermostcooling plate; a second supporting member disposed below the lowermostcooling plate; first and second pressing support portions disposedbetween the lowermost cooling plate and the second supporting member,and a pressing member comprising a protruding region disposed betweenthe uppermost cooling plate and the first supporting member andprotruded on the first supporting member through the first supportingmember, and the method may include pressing the first pressing supportportion using a first pressing device to raise the first pressingsupport portion in an upward direction when a specific switch disposedbetween a first cooling plate and a second cooling plate above the firstcooling plate among the plurality of cooling plates is damaged; removingthe second pressing support portion; arranging a second pressing devicearound the specific switch between the first cooling plate and thesecond cooling plate; pressing the second cooling plate using the secondpressing device to separate the second cooling plate from the specificswitch; and removing the specific switch and inserting a new switch.

Here, said raising the first pressing support portion may include fixingthe first pressing device to the first pressing support portion throughthe first supporting member and the second pressing support portion.

Furthermore, the second pressing device may include a first pressingportion and a second pressing portion, and the first pressing portionmay be disposed between the first cooling plate and the second coolingplate on a first side of the specific switch, and the second pressingportion may be disposed between the first cooling plate and the secondcooling plate on a second side of the specific switch.

Furthermore, the method may further include allowing at least two ormore guide rods to pass through each of the cooling plates to fix theplurality of cooling plates prior to raising the first pressing supportportion.

Furthermore, the method may further include fixing the protruding regionof the pressing member using a clamp.

In addition, the method may further include removing pressure applied tothe second cooling plate using the second pressing device when the newswitch is inserted; removing the clamp from the protruding region;raising the first pressing support portion in an upward direction usingthe first pressing device; inserting the second pressing support portionbetween the first pressing support portion and the first supportingmember; and removing the guide rods.

According to another aspect of the present disclosure, there is provideda pressing device for separating adjacent first and second coolingplates in a switching module comprising a plurality of cooling platesstacked along a vertical direction and a switch disposed between thecooling plates, and the pressing device may include a first pressingportion disposed between the first cooling plate and the second coolingplate on a first side of a specific switch; and a second pressingportion disposed between the first cooling plate and the second coolingplate on a second side of the specific switch.

Here, each of the first and second pressing portions may include apressure supply portion configured to supply pressure; a support platedisposed below the pressure supply portion to be in contact with anupper surface of the first cooling plate; and a pressure transmissionportion disposed above the pressure supply portion to be in contact withan upper surface of the second cooling plate and press the secondcooling plate using the supplied pressure.

Furthermore, each of the first and second pressing portions may furtherinclude a pressure drive portion disposed between the pressure supplyportion and the pressure transmission portion to drive the pressuretransmission portion

Furthermore, the pressure drive portion may move in a vertical directionby the supplied pressure.

Furthermore, the pressing device may further include a pressuregeneration portion connected to the first and second pressing portionsto generate the pressure.

In addition, the pressure generation portion may include a knob.

The effects of the pressing device of the switching module and themethod of replacing the switching module according to the embodiment ofthe present invention will be described as follows.

According to at least one of embodiments, a thyristor and a switch maybe stacked in a vertical direction, thereby having an advantage capableof optimizing arrangement structure and minimizing the occupied area.

According to at least one of embodiments, a cooling plate through whichcooling water flows on the upper and lower surfaces of the switch may beprovided, thereby having an advantage of facilitating heat dissipationof the switch.

According to at least one of embodiments, the switch, the cooling plate,and the like may be modularized, thereby having an advantage offacilitating installation.

According to at least one of embodiments, the pressing device may bedisposed between the first and second cooling plates disposed with thedamaged switch therebetween to increase a gap between the first andsecond cooling plates by the pressing device, and then the damagedswitch may be replaced with a new switch, thereby further facilitatingswitch replacement.

Further scope of applicability of the embodiments will become apparentfrom the detailed description given hereinafter. However, it should beunderstood that the detailed description and specific embodiments suchas preferred embodiments are given by way of illustration only, sincevarious changes and modifications within the spirit and scope of theembodiments will become apparent to those skilled in the art from thisdetailed description.

BRIEF DESCRIPTION OF THE DRAWING

The accompanying drawings, which are included to provide a furtherunderstanding of the invention and are incorporated in and constitute apart of this specification, illustrate embodiments of the invention andtogether with the description serve to explain the principles of theinvention.

In the drawings:

FIG. 1 is a perspective view illustrating a switch assembly of areactive power compensation apparatus according to an embodiment;

FIG. 2 is an exploded perspective view illustrating a switch assembly ofa reactive power compensation apparatus according to an embodiment;

FIG. 3 is a plan view illustrating a switch assembly of a reactive powercompensation apparatus according to an embodiment;

FIG. 4 is a front view illustrating a switching module according to anembodiment;

FIG. 5 is a perspective view illustrating a switching module accordingto an embodiment;

FIGS. 6 through 11 illustrate a method of replacing a switch in a firstswitching module according to an embodiment; and

FIGS. 12 and 13 illustrate a pressing device according to an embodiment.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

Hereinafter, the embodiments disclosed herein will be described indetail with reference to the accompanying drawings, and the same orsimilar elements are designated with the same numeral referencesregardless of the numerals in the drawings and their redundantdescription will be omitted. A suffix “module” and “unit” used forconstituent elements disclosed in the following description is merelyintended for easy description of the specification, and the suffixitself does not give any special meaning or function. In describing theembodiments disclosed herein, moreover, the detailed description will beomitted when specific description for publicly known technologies towhich the invention pertains is judged to obscure the gist of thepresent disclosure. Furthermore, it should be understood that theaccompanying drawings are merely illustrated to easily understand anembodiment disclosed herein, and therefore, the technological conceptdisclosed herein is not limited by the accompanying drawings, and theconcept of the present disclosure should be understand to include allmodifications, equivalents, and substitutes included in the concept andtechnological scope of the embodiment.

FIG. 1 is a perspective view illustrating a switch assembly of areactive power compensation apparatus according to an embodiment, andFIG. 2 is an exploded perspective view illustrating a switch assembly ofa reactive power compensation apparatus according to an embodiment, andFIG. 3 is a plan view illustrating a switch assembly of a reactive powercompensation apparatus according to an embodiment. The reactive powercompensating apparatus illustrated in FIGS. 1 through 3 illustrate astationary reactive power compensating apparatus, for instance, but theembodiment is not limited thereto.

FIGS. 1 through 3 illustrate a single switch assembly, but a pluralityof switch assemblies electrically connected to each other are alsopossible.

<Support Module>

A switch assembly of a reactive power compensation apparatus accordingto an embodiment may provide a support module 400.

The support module 400 may support all components constituting thereactive power compensation apparatus. The support module 400 may allowthe components disposed thereon to be insulated from the earth.

The support module 400 may include a frame 401 including four columnsand four connecting portions that connect these columns. The frame 401may be made of a material having excellent insulation and excellentsupporting strength. For instance, the frame 401 may be made ofstainless steel or a steel beam.

For instance, the column may be provided with an insulating member 403or the column itself may be the insulating member 403. The insulatingmember 403 may be an insulator. The insulator is an insulating body usedfor insulating and supporting an electric conductor, and hard porcelainmay be used for the insulating body, for instance.

Though will be described later, the support module 400 may be providedwith a fastening portion for fastening an optical cable 397 or afastening portion for fastening first and second main pipes 380, 390.The optical cable 397 supplies a drive signal, for example, a gatesignal, to a first switching module 100 or a second switching module200, or supplies various signals measured from the first switchingmodule 100 or the second switching module 200, for instance, a voltagesignal, a current signal, a temperature signal, and the like, to acontroller (not shown). The first and second main pipes 380, 390 supplycooling water to the first switching module 100 or the second switchingmodule 200 to cool the first switching module 100 or the secondswitching module 200.

<First Switching Module 100>

A switch assembly of a reactive power compensation apparatus accordingto an embodiment may include the first switching module 100. The firstswitching module 100 may have a first stack structure that isperpendicular to the support module 400. The first switching module 100will be described in detail with reference to FIGS. 4 and 5. FIG. 4 is afront view illustrating a switching module according to an embodiment,and FIG. 5 is a perspective view illustrating a switching moduleaccording to an embodiment.

Referring to FIGS. 4 and 5, the first switching module 100 may bedisposed on the support module 400. A second support plate 370 whichwill be described later is fastened to an upper surface of the supportmodule 400, and both the first switching module 100 and the secondswitching module 200 may be fastened to the second support plate 370. Asecond support plate 370 may be disposed under the first switchingmodule 100 and the second switching module 200. Moreover, a secondsupport plate 360 may be disposed under the first switching module 100and the second switching module 200. In this case, an upper side of eachof the first and second switching modules 100, 200 may be fastened tothe first support plate 360. Accordingly, the first and second switchingmodules 100, 200 may be disposed between the first support plate 360 andthe second support plate 370.

The first switching module 100 may include a plurality of switches 101stacked along a vertical direction with respect to the support module400. The first switching module 100 may be a forward switching module inwhich a current flows from the second electrode plate 110 to the firstelectrode plate 107 in an upward direction, for instance, but thepresent disclosure is not limited thereto.

The plurality of switches 101 may be connected in series to each other.A first switch is provided, a second switch is disposed on the firstswitch, and a second switch is disposed on the second switch. In thismanner, the plurality of switches 101 may be arranged on the supportmodule 400.

The switch 101 may be formed in a circular shape when viewed from above,but the present disclosure is not limited thereto. The switch 101includes a body, and a semiconductor device may be embedded in the body.The body may be made of insulating material. Each of the lower surfaceand the upper surface of the body may have a planar shape.

The switch 101 may be a semiconductor device, for instance, a thyristor.The switch 101 may include a gate, an anode, and a cathode. Forinstance, it is assumed that a first switch, a second switch, and athird switch are sequentially arranged on the support module 400. Inthis case, the cathode of the second switch may be electricallyconnected to the anode of the first switch, and the anode of the secondswitch may be electrically connected to the cathode of the third switch.

The first switching module 100 may include a plurality of cooling plates104 stacked along a vertical direction with respect to the supportmodule 400. The switch 101 may be disposed between the cooling plates104. The switch 101 and the cooling plate 104 may be alternatelystacked. For instance, the cooling plate 104 is provided, the switch 101is disposed on the cooling plate 104, and the cooling plate 104 isdisposed on the switch 101. The cooling plate 104 may be provided on theuppermost switch among the plurality of switches 101 and the coolingplate 104 may be provided below the undermost switch among the pluralityof switches 101. In other words, when n switches 101 are providedtherein, (n+1) cooling plates may be provided therein. In this case, thefirst switch is located on the first cooling plate, and the nth switchis located under the (n+1)th cooling plate.

The cooling plate 104 may have a rectangular shape, for instance, whenviewed from above, but the present disclosure is not limited thereto.The size of the cooling plate 104 may be larger than that of the switch101 at least. The switch 101 may be located at the center of the coolingplate 104, but the present disclosure is not limited thereto.

The cooling plate 104 and the switch 101 may be in surface contact. Forinstance, an upper surface of the first cooling plate may be in surfacecontact with a lower surface of the first switch. A lower surface of thesecond cooling plate is in surface contact with an upper surface of thefirst switch, and an upper surface of the second cooling plate is insurface contact with a lower surface of the second switch. A lowersurface of the third cooling plate may be in surface contact with anupper surface of the second switch.

As described above, the lower surface and the upper surface of theswitch 101 may be brought into surface contact with the cooling plate104 disposed below and above the switch 101 to cool the switch 101 bythe cooling plate 104, thereby easily releasing heat generated from theswitch 101. The remaining switches other than the first switch, thesecond switch, and the third switch of the plurality of switches 101 andthe remaining cooling plates other than the first cooling plate, thesecond cooling plates, and the third cooling plate of the plurality ofcooling plates 104 may also have the foregoing arrangement structure.

The first switching module 100 may include first and second electrodeplates 107, 110 that are electrically connected to a plurality ofvertically disposed switches 101.

For instance, the first electrode plate 107 may be disposed on a switchlocated at the top among the plurality of vertically disposed switches101. For instance, the second electrode plate 110 may be disposed on aswitch located at the bottom among the plurality of vertically disposedswitches 101.

As described above, the cooling plate 104 may be disposed above andbelow the switch 101 for cooling the switch 101. Therefore, since thecooling plate 104 is located between the first electrode plate 107 andthe switch 101, the first electrode plate 107 may be electricallyconnected to the switch 101 through a connecting member (not shown), butthe present disclosure is not limited thereto. Similarly, since thecooling plate 104 is located between the second electrode plate 110 andthe switch 101, the second electrode plate 110 may be electricallyconnected to the switch 101 through a connecting member (not shown).

The first and second electrode plates may be copper plates made ofcopper (Cu), but the present disclosure is not limited thereto.

The first electrode plate 107 may be in surface contact with the coolingplate 104 disposed at the top and the second electrode plate 110 may bein surface contact with the cooling plate 104 disposed at the bottom.

The first switching module 100 may include first and second terminals113, 116 connected to the first and second electrode plates 110,respectively.

The first and second terminals 113, 116 may be made of a metal havingexcellent electrical conductivity. For instance, the first and secondterminals 113, 116 may include copper (Cu) or aluminum (Al).

The first terminal 113 may be electrically connected to the firstelectrode plate 107. The first terminal 113 may be bent at least oncefrom the first electrode plate 107 and protruded along a lateraldirection. For instance, the first terminal 113 may include a firstregion protruded from the first electrode plate 107 in a lateraldirection, a second region extended subsequent to being bent in anupward direction from an end of the first region, and a third regionextended from an end of the second region along a lateral direction. Thesecond terminal 116 may be electrically connected to the secondelectrode plate 110. The second terminal 116 may be bent at least oncefrom the second electrode plate 110 and protruded along a lateraldirection. For instance, the first terminal 113 and the second terminal116 may be protruded in the same direction, but the present disclosureis not limited thereto.

The first and second terminals 113, 116 may be protruded along lateraldirections opposite to each other. For instance, the first terminal 113may be protruded along a first lateral direction, for instance, and thesecond terminal 116 may be protruded along a second lateral direction,for instance, opposite to the first lateral direction.

The first switching module 100 may include first and second supportingmembers 125, 128 provided to support a plurality of switches 101 and aplurality of cooling plates 104.

The first and second supporting members 125, 128 may have a plate shape.The first and second supporting members 125, 128 may have a rectangularshape when viewed from above.

The first and second supporting members 125, 128 may be made of amaterial having excellent insulating properties and supporting strength.For instance, the first and second supporting members 125, 128 may bemade of stainless steel.

For instance, the first supporting member 125 may be disposed above thetop cooling plate among the plurality of cooling plates 104. Forinstance, the second supporting member 128 may be disposed under thebottom cooling plate among the plurality of cooling plates 104.

A size of each of the first and second supporting members 125, 128 maybe larger than that of the cooling plate 104. The size of each of thefirst and second supporting members 125, 128 is large, and thus thesupport rods 135, 136, 137, 138, which will be described later, may bespaced apart from the cooling plate 104 and disposed on a side surfaceof the switch 101 and the cooling plate 104. In other words, thefastening of the support rods 135, 136, 137, 138 may be facilitatedbecause the support rods 135, 136, 137, 138 are not disturbed by thecooling plate 104.

The first switching module 100 may include a plurality of support rods135, 136, 137, 138 disposed between the first supporting member 125 andthe second supporting member 128. Although four support rods 135, 136,137, 138 are illustrated in the drawing, four or fewer or four or moresupport rods may be provided.

The support rods 135, 136, 137, 138 have a circular shape when viewedfrom above, but the present disclosure is not limited thereto. Thesupport rods 135, 136, 137, 138 are disposed between the firstsupporting member 125 and the second supporting member 128 so that oneside is fastened to the first supporting member 125 and the other sideis connected to the second supporting member 128. The first and secondsupporting members may be supported by the support rods 135, 136, 137.

The support rods 135, 136, 137, 138 may be made of a material havingexcellent insulating properties and supporting strength. For instance,the support rods 135, 136, 137, 138 may be made of stainless steel.

The first switching module 100 may include first and second pressingmembers 131, 134 for pressing a plurality of switches 101 and aplurality of cooling plates 104 in a vertical direction.

The first and second pressing members 131, 134 may have elasticity. Forinstance, a first pressing member 131 may be pressed in a downwarddirection by the first supporting member 125. A plurality of switches101 and a plurality of cooling plates 104 disposed below the firstpressing member 131 may also be pressed in a downward direction as thefirst pressing member 131 is pressed in a downward direction. Forinstance, a second pressing member 134 may be pressed in an upwarddirection by the second supporting member 128. A plurality of switches101 and a plurality of cooling plates 104 disposed above the secondpressing member 134 may also be pressed along an upward direction as thesecond pressing member 134 is pressed in an upward direction.

The first switching module 100 may include a plurality of thyristors anda signal generation unit 140 disposed on a side surface of the pluralityof cooling plates 104.

The signal generation unit 140 may include a substrate 141 and aplurality of drive units 143 mounted on the substrate 141. The signalgeneration unit 140 may further include a signal line 145 electricallyconnecting the drive unit 143 and each switch 101. The drive unit 143may generate a gate signal for switching each switch 101 to provide itto the each switch 101 through each signal line 145. Each switch 101 maybe switched by the gate signal.

One side of the substrate 141 may be fastened to the first supportingmember 125 and the other side thereof may be fastened to the secondsupporting member 128.

<Second Switching Module 200>

A switch assembly of a reactive power compensation apparatus accordingto an embodiment may include the second switching module 200. The secondswitching module 200 may be a reverse switching module in which acurrent flows from the first electrode plate 107 to the second electrodeplate 110 in a downward direction, for instance, but the presentdisclosure is not limited thereto.

The second switching module 200 may be disposed on the same plane as thefirst switching module 100. In other words, the second switching module200 may be mounted on an upper surface of the support module 400. Forinstance, the first switching module 100 may be disposed on a firstregion of the support module 400, and the second switching module 200may be disposed on a second region of the support module 400.

The second switching module 200 may include a plurality of switches 201,a plurality of cooling plates 204, first and second electrode plates207, 210, first and second terminals 213, 216, first and secondsupporting members 225, 228, a plurality of support rods 235, 236, 237,238, first and second pressing members 231, 234 and a signal generationunit 240.

The switch 201 of the second switching module 200 may have the samestructure as that of the switch 201 of the first switching module 100.The cooling plate 204 of the second switching module 200 may have thesame structure as the cooling plate 104 of the first switching module100. The first and second electrode plates 207, 210 of the secondswitching module 200 may have the same structure as the first and secondelectrode plates 107, 110 of the first switching module 100. The firstand second electrode plates 213, 216 of the second switching module 200may have the same structure as the first and second terminals 113, 116of the first switching module 100. The first and second supportingmembers 225, 228 of the second switching module 200 may have the samestructure as the first and second supporting members 125, 128 of thefirst switching module 100. The support rod of the second switch module200 may have the same structure as the support rod of the firstswitching module 100. The first and second electrode plates 231, 234 ofthe second switching module 200 may have the same structure as the firstand second pressing members 131, 134 of the first switching module 100.The signal generation unit 240 of the second switching module 200 mayhave the same structure as the signal generation unit 140 of the firstswitching module 100. Accordingly, each component of the secondswitching module 200 may be easily understood from the respectivecomponents of the first switching module 100 described in detail above,and thus each component of the second switching module 200 will bebriefly described.

A plurality of cooling plates 204 are provided, and a switch 201 may bedisposed between the cooling plates 204. In other words, the secondswitching module 200 may have a second stack structure in which aplurality of cooling plates 204 and a plurality of switches 201 arestacked along a vertical direction with respect to the support module400.

The cooling plate 204 and the switch 201 may be in surface contact. Asdescribed above, the lower surface and the upper surface of the switch201 may be brought into surface contact with the cooling plate 204disposed below and above the switch 201 to cool the switch 201 by thecooling plate 204, thereby easily releasing heat generated from theswitch 201.

The first electrode plate 207 may be disposed above a switch located atthe top of a plurality of vertically disposed switches 201. Forinstance, the second electrode plate 210 may be disposed on a switchlocated at the bottom among the plurality of vertically disposedswitches 201.

The cooling plate 204 may be located between the first electrode plate207 and the switch 201.

The first terminal 213 may be electrically connected to the firstelectrode plate 207, and bent at least once from the first electrodeplate 207 and protruded along a lateral direction. The second terminal216 may be electrically connected to the second electrode plate 210, andbent at least once from the second electrode plate 210 and protrudedalong a lateral direction. The first and second terminals 213, 216 maybe protruded along lateral directions opposite to each other.

The first supporting member 225 is disposed above the top of theplurality of cooling plates 204, and the second supporting member 228 isdisposed below the bottom of the plurality of cooling plates 204.Accordingly, a plurality of switches 201 and a plurality of coolingplates 201 disposed between the first supporting member 225 and thesecond supporting member 228 may be supported by the first supportingmember 225 and the second supporting member 228.

A plurality of support rods may be fastened to the first supportingmember 225 and the second supporting member 228 to support the first andsecond supporting members.

The plurality of switches 201 and the plurality of cooling plates 204disposed between the first and second pressing members 231, 234 may bepressed by the first and second pressing members 231, 234.

The signal generation unit 240 may include a substrate 241 and aplurality of drive units 243 mounted on the substrate 241. The signalgeneration unit 240 may further include a signal line 245 electricallyconnecting the drive unit 243 and each switch 201. The signal generationunit 240, as a member for generating a gate signal for switching eachswitch 201, may be disposed on a side surface of the plurality ofswitches 201 and the plurality of cooling plates 204 and fastened to thefirst supporting member 225 and the second supporting member 228.

<Connection Cooling Plate 105>

A switch assembly of a reactive power compensation apparatus accordingto an embodiment may include a connection cooling plate 105 forconnecting a cooling unit of the first switching module 100 and acooling unit of the second switching module 200.

The connection cooling plate 105 may be made of the same material asthat of the cooling unit of the first switching module 100 and thecooling unit of the second switching module 200, but the presentdisclosure is not limited thereto.

The connection cooling plate 105 is detachable from the cooling unit ofthe first switching module 100 and the cooling unit of the secondswitching module 200. In other words, the connection cooling plate 105may be fastened or unfastened to the cooling unit of the first switchingmodule 100 and the cooling unit of the second switching module 200.

<Connection Electrodes 117, 118>

The switch assembly of the reactive power compensation apparatusaccording to an embodiment may include first and second connectingelectrodes 117, 118.

The first connecting electrode 117 may fasten a first terminal 113 ofthe first switching module 100 and a first terminal 213 of the secondswitching module 200. Accordingly, the first terminal 113 of the firstswitching module 100 and the first terminal 213 of the second switchingmodule 200 may be electrically connected to the first connectingelectrode 117.

The second connecting electrode 118 may fasten a second terminal 116 ofthe first switching module 100 and a second terminal 216 of the secondswitching module 200. Accordingly, the second terminal 116 of the firstswitching module 100 and the second terminal 216 of the second switchingmodule 200 may be electrically connected to the second connectingelectrode 118.

<First and Second Bus Bars 119, 122>

The switch assembly of the reactive power compensation apparatusaccording to an embodiment may include first and second bus bars 119,122.

The first bus bar 119 may be fastened to the first connecting electrode117. At least one or more first bus bars may be fastened to the firstconnecting electrode 117. The first bus bar 119 may be bent at leastonce from the first connecting electrode 117 and protruded in a lateraldirection. The second bus bar 122 may be fastened to the secondconnecting electrode 118. At least one or more second bus bars may befastened to the second connecting electrode 118. The second bus bar 122may be bent at least once from the second connecting plate 118 andprotruded along a lateral direction.

The first and second bus bars 119, 122 may be protruded along lateraldirections opposite to each other.

In the embodiment, the first electrode plates 107, 207, the secondelectrode plates 110, 210, the first terminals 113, 213, the secondterminals 116, 216, the first connecting electrode 117, the secondconnecting electrode 118, the first bus bar 119, and the second bus bar122 may be made of a metal material having excellent electricalconductivity. The first electrode plates 107, 207, the second electrodeplates 110, 210, the first terminal 117, the second terminal 118, thefirst bus bar 119, and the second bus bar 122 may be made of the samemetal material, but the present disclosure is not limited thereto.

<Snubber Circuits 300, 310, 320, 330>

The switch assembly of the reactive power compensation apparatusaccording to an embodiment may include snubber circuits 300, 310, 320,330. The snubber circuit may include a first resistor module 300, asecond resistor module 310, a first capacitor module 320, and a secondcapacitor module 330.

The first resistor module 300 may include a first resistor substrate 301and a plurality of first resistor devices 303 mounted on the firstresistor substrate 301. For instance, the plurality of first resistordevices 303 may be connected in series. The second resistor module 310may include a second resistor substrate 311 and a plurality of secondresistor devices 313 mounted on the second resistor substrate 311. Forinstance, the plurality of second resistor devices 313 may be connectedin series.

The first capacitor module 320 may include a first capacitor substrate321 and a plurality of first capacitor devices 323 mounted on the firstcapacitor substrate 321. For instance, the plurality of first capacitordevices 323 may be connected in parallel. The second capacitor module330 may include a second capacitor substrate 331 and a plurality ofsecond capacitor devices 333 mounted on the second capacitor substrate331. For instance, the plurality of second capacitor devices 333 may beconnected in parallel.

In terms of electric circuit, the first resistor device 303 and thesecond resistor device 313 are connected in series, and the first andsecond capacitor devices 303, 313 are connected between the firstresistor device 303 and the second resistor device 313. The first andsecond capacitor devices 321, 333 may are connected in parallel.

In terms of arrangement structure, the first resistor substrate 301 ofthe first resistor module 300 may be fastened to the first supportingmember 125 at one side and fastened to the second supporting member 128at the other side. The second resistor substrate 311 of the secondresistor module 310 may be fastened to the first supporting member 225at one side and fastened to the second supporting member 228 at theother side. The first capacitor substrate 321 of the first capacitormodule 320 may be fastened to the first supporting member 125 at oneside and fastened to the second supporting member 128 at the other side.The second capacitor substrate 331 of the second capacitor module 330may be fastened to the first supporting member 225 at one side andfastened to the second supporting member 228 at the other side.Moreover, the first resistor module 300 may be disposed on one side ofthe first switching module 100, and the second resistor module 310 maybe disposed on one side of the second switching module 200. The firstand second capacitor modules 320 may be disposed on the other side ofthe first switching module 100, and the second capacitor module 330 maybe disposed on the other side of the second switching module 200.

In terms of cooling, first branch pipes 381, 383 branched from the firstmain pipe 380 are connected to the cooling plate 104 of the firstswitching module 100 and the cooling plate 204 of the second switchingmodule 200. The first connection pipe 411 may be connected between thecooling plate 104 of the first switching module 100 and the resistordevice 303 of the first resistor module 300. The second connection pipe413 may be connected between the cooling plate 204 of the secondswitching module 200 and the resistor device 313 of the second resistormodule 310. The second branch pipes 391, 393 may be connected from thesecond main pipe 390 to the resistor device 303 of the first resistormodule 300 and the resistor device 313 of the second resistor module310. Accordingly, cooling water is supplied to the cooling plate 104 ofthe first switching module 100 and the cooling plate 204 of the secondswitching module 200 through the first main pipe 380 and the firstbranch pipes 381, 383 to cool the switch 101 of the first switchingmodule 100 and the switch 201 of the second switching module 200, andthen discharged through the first and second connection pipes 411, 413,the second branch pipes 391, 393 and the second main pipe 390.

<First and Second Support Plates 360, 370>

The switch assembly of the reactive power compensation apparatusaccording to an embodiment may include first and second support plates360, 370 disposed above and below the first and second switching modules100, 200.

The first and second switching modules 100, 200 may be disposed betweenthe first support plate 360 and the second support plate 370. The firstand second switching modules 100, 200 may be supported by the firstsupport plate 360 and the second support plate 370. For instance, anupper side of the first and second switching modules 100, 200 isfastened to the first support plate 360 and a lower side of the firstand second switching modules 100, 200 is fastened to the second supportplate 370. The second support plate 370 may be fastened to an upper sideof the support module 400.

<First and Second Corona Shields 340, 350>

The switch assembly of the reactive power compensation apparatusaccording to an embodiment may include first and second corona shields340, 350.

The first and second corona shields 340, 350 may have a ring shapelarger than a size of each of the first and second support plates 360,370. Each of the first and second corona shields 340, 350 may bedisposed to surround the first and second support plates 360, 370, andfastened to at least one or more regions of the first and second supportplates 360, 370. Since the first and second corona shields 340, 350 arelarger than the size of each of the first and second support plates 360,370, the first and second corona shields 340, 350 may be disposed to bespaced apart in an outward direction from each of the first and secondsupport plates 360, 370. Accordingly, as intermediate connectingmembers, a plurality of fastening connecting portion may be provided tofasten the first and second corona shields 340, 350 to the first andsecond support plates 360, 370.

<First and Second Main Pipes 380, 390, First and Second Branch Pipes381, 383, 391, 393, and First and Second Connecting Pipes 411, 413>

The reactive power compensating apparatus according to an embodiment mayinclude first and second main pipes 380, 390, first and second branchpipes 381, 383, 391, 393, and first and second connecting pipes 411,413.

The first main pipe 380 may be disposed on one side surface of one ofthe first and second switching modules 100, 200. The second main pipe390 may be disposed on the other side surface of one of the first andsecond switching modules 100, 200.

The first branch pipes 381, 383 may be branched from the first main pipe380 in both directions and connected to the cooling plates 104, 204 ofthe first and second switching modules 100, 200, respectively. Thesecond branch pipes 391, 393 may be branched from the second main pipe390 in both directions and connected to the resistor devices 303, 313 ofthe first and second resistor modules 300, 310, respectively.

The first connection pipe 411 may be connected between the cooling plate104 of the first switching module 100 and the resistor device 303 of thefirst resistor module 300. The second connection pipe 413 may beconnected between the cooling plate 204 of the second switching module200 and the resistor device 313 of the second resistor module 310.

Accordingly, cooling water is supplied to the cooling plate 104 of thefirst switching module 100 and the cooling plate 204 of the secondswitching module 200 through the first main pipe 380 and the firstbranch pipes 381, 383 to cool the switch 101 of the first switchingmodule 100 and the switch 201 of the second switching module 200, andthen discharged through the first and second connection pipes 411, 413,the second branch pipes 391, 393 and the second main pipe 390.

For instance, the first and second main pipes 380, 390, the first andsecond branch pipes 381, 383, 391, 393 and the first and secondconnection pipes 411, 413 may be made of different materials. Forinstance, the first and second main pipes 380, 390, the first and secondbranch pipes 381, 383, 391, 393 may be made of a resin material, and thefirst and second connection pipes 411, 413 may be made of a copper (Cu)material.

The first and second connection pipes 411, 413 are disposed adjacent tothe switches 101, 201 of the first and second switching modules 100,200. A considerable amount of heat is generated in the switches 101, 201of the first and second switching modules 100, 200, and thus the firstand second connection pipes 411, 413 must be formed of a material havingexcellent heat resistance. Therefore, the first and second connectionpipes 411, 413 are made of copper, and thus not affected by heatgenerated by the switches 101, 201 of the first and second switchingmodules 100, 200.

The first and second main pipes 380, 390 and the first and second branchpipes 381, 383, 391, 393 are disposed on an outer surfaces of the firstand second switching modules 100, 200, and thus hardly affected by heatgenerated by the switching of the first and second switching modules100, 200. Therefore, a resin material which is cheaper than copper maybe used for the first and second main pipes 380, 390 and the first andsecond branch pipes 381, 383, 391, 393.

In the above description, the first switching module 100 may be referredto as a second switching module, and the second switching module 200 maybe referred to as a first switching module. The first electrode plate107, 207 may be referred to as a second electrode plate and the secondelectrode plate 110, 210 may be referred to as a first electrode plate.The first terminal 113, 213 may be referred to as a second terminal, andreferred to as a second terminal 116, 216. The first connectingelectrode 117 may be referred to as a second connecting electrode, andthe second connecting electrode 118 may be referred to as a firstconnecting electrode. The first bus bar 119 may be referred to as asecond booth bar, and the second bus bar 122 may be referred to as afirst booth bar. The first supporting member 125, 225, 360 may bereferred to as a second supporting member, and the second supportingmember 128, 228, 370 may be referred to as a first supporting member.The first pressing member 131, 231 may be referred to as a secondpressing member, and the second pressing member 134, 234 may be referredto as a first pressing member. The first resistor module 300 may bereferred to as a second resistor module, and the second resistor module313 may be referred to as a first resistor module. The first main pipe380 may be referred to as a second main pipe, and the second main pipe390 may be referred to as a first main pipe. The first connection pipe411 may be referred to as a second connection pipe, and the secondconnection pipe 413 may be referred to as a first connection pipe.

Hereinafter, a method of replacing a switch in a switching module willbe described.

FIGS. 6 through 11 illustrate a method of replacing a switch in a firstswitching module according to an embodiment.

Though a method of replacing a switch in a first switching module 100 isillustrated in FIGS. 6 through 11, the first switching module 100 andthe second switching module 200 have the same switch replacement method.Therefore, the description of the switch replacement method in thesecond switching module 200 will be omitted and easily understood fromFIGS. 6 through 11.

As illustrated in FIG. 6, when a specific switch 101 a is damaged amonga plurality of switches 101 disposed between a plurality of coolingplates 104, the specific switch 101 a must be replaced.

According to an embodiment, the damaged specific switch 101 a may bequickly and easily replaced. In order to replace the specific switch 101a, it is not required to remove all components located above thespecific switch 101 a, for instance, the plurality of switches 101, theplurality of cooling plates 104, the first pressing member 131, thefirst supporting member 125, and the plurality of support rods 135, 136,137, 138. In other words, the second cooling plate 104 b may beseparated from the specific switch 101 a by separating between adjacentcooling plates 104 a, 104 b (hereinafter, referred to as first andsecond cooling plates) disposed above/below the damaged specific switch101 a, and then the relevant specific switch 101 a may be removed toinsert a new switch.

FIG. 7 is a perspective view illustrating a lower side of the firstswitching module according to an embodiment, and FIG. 8 is a partialcutaway view illustrating a lower side of the first switching moduleaccording to an embodiment.

As illustrated in FIGS. 7 and 8, the first pressing device 180 may befixed to a lower side of the first switching module 100.

Specifically, at least two or more guide rods 450, 452 may be fixed tothe insertion guide portion 165 through holes (not shown) formed in theprotruding portions 437, 438 of the cooling plates 104, respectively.The alignment of the plurality of cooling plates 104 may be maintainedeven when pressing applied between the first supporting member 125 andthe second supporting member 128 is released due to the support of theguide rods 450, 452.

The pressure transmission portion 183 of the first pressing device 180may be inserted through the insertion hole 167 of the insertion guideportion 165 and fixed to the first pressing support portion 161 throughthe second pressing support portion 163. The protruding portion 187 ofthe pressure transmission portion 183 of the first pressing device 180may be inserted into the insertion groove 162 of the first pressingsupport portion 161. Moreover, the vertical portion 166 b of theinsertion guide portion 165 may be inserted into a groove between thefastening portion 185 and the pressure transmission portion 183 of thefirst pressure device 180. Accordingly, the first pressing device 180may be fixed to the first switching module 100.

The second pressing member 134 may be disposed between the secondelectrode plate and the second supporting member 128. The secondpressing member 134 may include a first pressing support portion 161 anda second pressing support portion 163. The insertion guide portion 165may be included in the second pressing member 134 or may not be includedin the second pressing member 134 but may exist as a separate component.

The first pressing support portion 161 may be disposed between thesecond electrode plate 110 and the second supporting member 128. Thesecond pressing support portion 163 may be disposed between the firstpressing support portion 161 and the insertion guide portion 165. Theinsertion guide portion 165 may be disposed between the second pressingsupport portion 163 and the second supporting member 128.

The insertion guide portion 165 may guide the insertion of the firstpressing device 180 to press the first pressing support portion by thefirst pressing device 180.

The insertion guide portion 165 may include a horizontal portion 166 adisposed on the second supporting member 128 and a vertical portion 166b extended through the second supporting member 128 from the horizontalportion. The horizontal portion may be brought into surface contact withthe second pressing support portion 163. The vertical portion 166 b mayinclude an insertion hole 167 into which the first pressing device 180,specifically, the pressure transmission portion 183 of the firstpressure device 180, is inserted. The pressure transmission portion 183of the first pressing device 180 is inserted through the insertion hole167 of the insertion guide portion 165 to transmit the pressing of thepressure transmission portion 183 to the first pressing support portion161.

The first pressing device 180 may include a cylinder. For the cylinder,a hydraulic cylinder may be used, but the present disclosure is notlimited thereto.

The first pressure device 180 may include a pressure supply portion 181for supplying pressure generated by the pump, that is, hydraulicpressure, and a pressure transmission portion 183 for transmitting thegenerated pressure. The first pressure device 180 may further include afastening portion 185 for fastening the pressure supply portion 181 tothe pressure transmission portion 183.

The first pressing support portion 161 may be pressed and raised alongan upward direction by pressure transmitted by the pressure transmissionportion 183 of the first pressing device 180. Accordingly, the firstpressing support portion 161 and the second supporting member 128 may bespaced apart from each other by at least a thickness larger than that ofthe second pressing support portion 163. In other words, the firstpressing support portion 161 may be spaced in an upward direction froman upper surface of the second pressing support portion 163, therebyeasily removing the second pressing support portion 163.

As illustrated in FIGS. 9 through 11, the first pressing portion 192 aand the second pressing portion 192 b of the second pressing device 190may be disposed around the specific switch 101 a. For instance, thefirst pressing portion 192 a may be disposed between the first coolingplate 104 a and the second cooling plate 104 b on a first side of thespecific switch 101 a. For instance, the second pressing portion 192 bmay be disposed between the first cooling plate 104 a and the secondcooling plate 104 b on a second side of the specific switch 101 a. Here,the first side may be located on an opposite side to the second side.

FIGS. 12 and 13 illustrate a pressing device according to an embodiment.Specifically, FIG. 12 illustrates a state prior to the pressuretransmission portion being moved in an upward direction in the pressingdevice according to an embodiment, and FIG. 13 illustrates a state ofthe pressure transmission portion being moved in an upward direction inthe pressing device according to an embodiment.

As illustrated in FIGS. 11 and 12, the second pressing device 190 mayinclude first and second pressing portions 192 a, 192 b, respectively,provided with pressure supply portions 191 a, 191 b, a pressure driveportion 198, pressure transmission portions 193 a, 193 b, and supportplates 197 a, 197 b.

The pressure supply portions 191 a, 191 b may supply pressure to thepressure drive portion 198.

The pressure drive portion 198 may be disposed on the pressure supplyportions 191 a, 191 b and moved up and down by the supplied pressure.When pressure is supplied to the pressure drive portion 198, thepressure drive portion 198 may be moved in an upward direction. Whenpressure is not supplied to the pressure drive portion 198, the pressuredrive portion 198 may be moved in a downward direction and returned.

As illustrated in FIG. 13, the pressure transmission portions 193 a, 193b may be disposed on the pressure drive portion 198, and moved up anddown in accordance with the upward and downward movement of the pressuredrive portion 198. When the first and second pressing portions 192 a,192 b of the second pressing device 190 are disposed between the firstcooling plate 104 a and the second cooling plate 104 b, an upper surfaceof the pressure transmission portions 193 a, 193 b of the first andsecond pressing portions 192 a, 192 b, respectively, may be brought intocontact with a lower surface of the second cooling plate 104 b. In thiscase, for instance, when the pressure drive portion 198 is moved in anupward direction, the pressure transmission portions 193 a, 193 b mayalso be moved in an upward direction to move the second cooling plate104 b in contact with the pressure transmission portions 193 a, 193 b inan upward direction.

The support plates 197 a, 197 b may be disposed below the pressuresupply portions 191 a, 191 b. The support plates 197 a, 197 b maysupport the first and second pressing portions 192 a, 192 b,respectively.

A lower surfaces of the support plates 197 a, 197 b and an uppersurfaces of the pressure transmission portions 193 a, 193 b may have aflat surface. A lower surfaces of the support plates 197 a, 197 b may bebrought into surface contact with an upper surface of the first coolingplate 104 a, and an upper surfaces of the pressure transmission portions193 a, 193 b may be brought into surface contact with a lower surface ofthe second cooling plate 104 b.

On the other hand, the second pressing device 190 may further include apressure generation portion 195 connected to the first and secondpressing device 192 a, 192 b to generate pressure. Pressure generatedfrom the pressure generation portion 195 may be transmitted to thepressure supply portions 191 a, 191 b of the first and second pressingportions 192 a, 192 b, respectively.

The pressure generation portion 195 may include a knob 196. The knob 196may be manipulated by an operator. In other words, the operator mayrepeat the operation of holding the knob 196 firmly and releasing it,thereby generating pressure from the pressure generation portion 195.

The pressure generation portion 195 is a high-performance hand pump, andeven when a pressure of about 6 to 7 bar is generated from the pressuregeneration portion 195, the pressure transmission portions 193 a, 193 bof the first and second pressing portions 192 a, 192 b, respectively,may be moved at least 10 mm or more in an upward direction.

Prior to the second cooling plate 104 b being pressed by the first andsecond pressing portions 192 a, 192 b of the second pressing device 190,a protruding region 151 of the pressing member 131 may be fixed by aclamp, as illustrated in FIG. 10.

The protruding region 151 of the first pressing member 131 may bedisposed between the uppermost cooling plate 104 and the firstsupporting member 125 and protruded through the first supporting member125. As described above, as the first pressing support portion 161 ismoved in an upward direction by the first pressing device 180, theprotruding region 151 of the first pressing member 131 may be furthermoved in an upward direction from an upper surface of the firstsupporting member 125. The protruding region 151 of the first pressingmember 131 moved in an upward direction as described above may fixed bythe clamp 170, thereby preventing the protruding region 151 of the firstpressing member 131 from moving in a downward direction.

As illustrated in FIG. 11, the second cooling plate 104 b may be pressedby the first and second pressing portions 192 a, 192 b of the secondpressing device 190, thereby moving the second cooling plate 104 b incontact with the pressure transmission portions 193 a, 193 b of thefirst and second pressing portions 192 a, 192 b, respectively, in anupward direction. Accordingly, a lower surface of the second coolingplate 104 b may be spaced apart along an upper direction from an uppersurface of the specific switch 101 a, thereby easily removing thespecific switch 101 a since nothing is disturbed by the removal of thespecific switch 101 a. For instance, in brief, the specific switch 101 amay be moved and removed in a first lateral direction in a slidingmovement manner on an upper surface of the first cooling plate 104 a.Instead, a new switch may be moved in a second lateral directionopposite to the first lateral direction in a sliding movement manner onan upper surface of the first cooling plate 104 a and inserted betweenthe first cooling plate 104 a and the second cooling plate 104 b.

The subsequent assembly process may be carried out in a reverse order tothe foregoing description.

In other words, pressing by the first and second pressing portions 192a, 192 b of the second pressing device 190 may be released, therebymoving the second cooling plate 104 b in a downward direction to place alower surface of the second cooling plate 104 b on an upper surface ofthe new switch.

The clamp 170 may be removed to release the fixation of the protrudingregion 151 of the first supporting member 125, thereby moving the firstsupport member 125 in a downward direction.

The first pressing support portion 161 on a lower side of the firstswitching module 100 may be moved in an upward direction using the firstpressing device 180, thereby separating the first pressing supportportion 161 from the second supporting member 128. The second pressingsupport portion 163 may be inserted into the separated space, that is,between the first pressing support portion 161 and the second supportingmember 128.

The pressing of the first pressing device 180 may be released, therebypressing the second pressing support portion 163 by the weight of thefirst pressing support portion 161.

At least two or more guide rods 450, 452 that have passed through theprotruding portions 437, 438 of each cooling plates 104 may be removed.

The detailed description thereof should not be construed as restrictivein all aspects but considered as illustrative. The scope of theembodiment should be determined by reasonable interpretation of theappended claims and all changes that come within the equivalent scope ofthe embodiment are included in the scope of the embodiment.

What is the claimed is:
 1. A method of replacing a switch in a switchingmodule comprising a plurality of cooling plates stacked along a verticaldirection; a switch disposed between the cooling plates; a firstsupporting member disposed above the uppermost cooling plate; a secondsupporting member disposed below the lowermost cooling plate; first andsecond pressing support portions disposed between the lowermost coolingplate and the second supporting member, and a pressing member comprisinga protruding region disposed between the uppermost cooling plate and thefirst supporting member and protruded on the first supporting memberthrough the first supporting member, the method comprising: allowing atleast two or more guide rods to pass through each of the cooling platesto fix the plurality of cooling plates; pressing the first pressingsupport portion using a first pressing device to raise the firstpressing support portion in an upward direction; removing the secondpressing support portion; arranging a second pressing device around aspecific switch disposed between a first cooling plate and a secondcooling plate on the first cooling plate among the plurality of coolingplates; pressing the second cooling plate using the second pressingdevice to separate the second cooling plate from the specific switch;fixing the protruding region of the pressing member using a clamp; andremoving the specific switch and inserting a new switch.
 2. The methodof claim 1, wherein said raising the first pressing support portioncomprises fixing the first pressing device to the first pressing supportportion through the first supporting member and the second pressingsupport portion.
 3. The method of claim 2, wherein the second pressingdevice comprises a first pressing portion and a second pressing portion,and the first pressing portion is disposed between the first coolingplate and the second cooling plate on a first side of the specificswitch, and the second pressing portion is disposed between the firstcooling plate and the second cooling plate on a second side of thespecific switch.
 4. The method of claim 1, further comprising: removingpressure applied to the second cooling plate using the second pressingdevice when the new switch is inserted; removing the clamp from theprotruding region; raising the first pressing support portion in anupward direction using the first pressing device; inserting the secondpressing support portion between the first pressing support portion andthe first supporting member; and removing the guide rods.